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    首頁  >  高速材料  >  詳情
    H6

    特性/ Features

    1. 高Tg:≥185℃ (DSC)   

    Tg:≥185℃ (DSC)

    2. 低介電常數(Dk≤3.7, 10GHz)   

    Low Dk≤3.7, 10GHz

    3. 低介質損耗(Df≤0.005, 10GHz)  

    Low Df≤0.005, 10GHz

    4. 優異的熱性能,Td≥340℃  

    Excellent Thermal Resistance, Td≥340℃

    5. 低Z軸熱膨脹系數  

    Low Z axis CTE

    6. 低吸水性,耐CAF性能好,高可靠性 

    Low water absorption, excellent anti-CAF, high reliability

    7. 無鉛制程兼容  

    Compatible with Lead-free 


    應用領域/ Applications 

    服務器、交換機、基站、汽車毫米波雷達、高性能計算機   

    Servers, Switch, Base station, Millimeter wave radar for Automotive, High performance computing, etc.


    主要特性 / General properties

    檢測項目

    Item

    單位

    Unit

    檢測條件

    Test Condition

    規范值

    Spec

    典型值

    Typical Value

    玻璃化轉變溫度Glass   Transition Temperature (Tg)

    DSC

    ≥185

    185

    DMA

    \

    208

    剝離強度 Peel   Strength 1oz Very low profile copper                                         

    RTF銅箔

    N/mm

    As Received

    \

    0.70

    VLP銅箔

    N/mm

    As Received

    \

    0.85

    熱應力Thermal   stress

    S

    288℃, solder dip

    10

    >180s No delamination                    

    彎曲強度                                    Flexural   Strength

    N/mm2

    經向 LW

    ≥345

    520

    緯向CW

    ≥345

    480

    燃燒性Flammability

    E 24/125

    UL94V-0

    V-0

    表面電阻Surface Resistivity

    After moisture

    ≥1.0×105

    1.56x108

    體積電阻Volume Resistivity

    MΩ·   cm

    After moisture

    ≥1.0×106

    2.21x109

    介電常數Dielectric   Constant(RC54%)

    10 GHZ SPC Method

    \

    3.65

    介質損耗角正切Loss   Tangent(RC54%)

    10 GHZ SPC Method

    \

    0.0048

    耐電弧Arc Resistance

    S

    D 48/50D 0.5/23

    ≥60

    125

    擊穿電壓Dielectric Breakdown

    KV

    D 48/50D 0.5/23

    ≥40

    58

    吸水率Moisture Absorption

    %

    D 24/23

    ≤0.2

    0.11

    熱分解溫度Td

    Weight Loss 5%

    ≥340

    405

    CTE                                       Z-axis

    Alpha 1

    ppm / ℃

    TMA

    ≤45

    40

    Alpha 2

    ppm / ℃

    ≤260

    258

    50 - 260 ℃

    %

    ≤2.8

    2.5

    T288

    min

    TMA

    ≥15

    60

    T300

    min

    TMA

    ≥2

    60

    Specimen thickness :0.750mm     

    Specification sheet:IPC-4101E/102,is for your reference only

    Explanation: C: Humidity conditioning   D: Immersion conditioning in distilled water   E: Temperature conditioning 


    產品系列 / Purchasing information

    板材規格:

    厚度

    Thickness

    銅箔

    Copper foil

    標準尺寸

    Standard size

    0.05~1.0mm  

    12um~70um

    37"×49"、41"×49"、43"×49"

    ※ Other sheet size and thickness could be available upon request


    建議壓制程式Suggest cycle

    20191008/c986e518ee2a172fcde97c78b2e82b64.png


    儲存條件Storage Condition

    溫度≤23℃、濕度≤50%,保存時間3個月;溫度≤5℃、密封條件下,保存時間6個月.

    T≤23℃& ≤50%RH, Within 3 months,T≤5 ℃ Within 6 months (seal condition).

    在上述要求內,我司可立即安排PP送樣;若有特殊要求,由供需雙方商定。

    Follow upwards condition, Our company will arrange sample immediately. We can negotiation if you have special requirement.

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